Total Investment Exceeds 7.5 Billion Yuan! USC HITS Advanced Packaging Project Lands in Shanghai Jiading
On July 30, 2026, Union Semiconductor (USC) held a signing ceremony for its HITS advanced packaging R&D and industrialization project in Shanghai's Jiading District. With total investment expected to reach at least 7.5 billion yuan, the project targets five core technical bottlenecks including ultra-narrow pitch bump bonding and high-density interposer integration, aiming to build the packaging and interconnect foundation for AI servers and high-performance computing chips.
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