Zhejiang Jingneng Microelectronics Co., Ltd. completed a joint-stock reform approved by market regulators and officially changed its name to Zhejiang Jingneng Microelectronics Corporation. The company entered the power semiconductor market with automotive-grade IGBT/SiC modules. It also disclosed two simultaneous technological advances: launching AI-grade SST-SiC modules for power supply links in AI data centers, and jointly developing next-generation high-voltage conversion technology with customers in the SST field; the results will target scenarios including AI computing infrastructure, new energy, and high-end equipment. The company said that after the shareholding reform it will increase R&D investment and deepen industrial chain collaboration, but its overseas revenue structure, customer distribution, and localization layout have not yet been disclosed.
Recently, with approval from the market regulatory authority, Zhejiang Jingneng Microelectronics Co., Ltd. completed an overall shareholding reform and was officially renamed Zhejiang Jingneng Microelectronics Co., Ltd. (joint-stock). This power semiconductor company, which entered the market with automotive-grade IGBT/SiC modules, concurrently disclosed two technology-side developments: the launch of an AI-grade SST-SiC module for the power supply chain of AI data centers (AIDC), and joint R&D with SST customers on next-generation high-voltage conversion technology.
Shareholding reform completed: governance structure adjustment and a new starting point
According to the disclosure, the change has been approved by the market regulatory authority, and the enterprise type has been wholly converted from a limited liability company into a joint-stock company. The company said it will take this as a new starting point, continue to increase R&D investment, focus on refining and upgrading core products, deepen industrial chain collaboration, accelerate the implementation of benchmark projects, and further consolidate its business barriers.
Power semiconductors are a sector with high R&D intensity and long customer validation cycles, and standardizing the equity structure is generally regarded as one of the prerequisites for supporting long-term R&D and industrial chain collaboration. The company did not elaborate on specific capital arrangements after the shareholding reform in this disclosure.
Automotive-grade SiC: formation of a first-tier player in a niche track
Jingneng Microelectronics entered the market early on with automotive-grade IGBT/SiC modules. The company said that, relying on its deep understanding of reliability models and accumulated technology, it has grown into a first-tier enterprise in this niche track in recent years.
Automotive-grade power devices are in core links such as vehicle electric drive and electronic control, where reliability validation and long-term supply capability constitute key thresholds for customer adoption. Entering in module form means suppliers need to build collaborative capabilities across chips, packaging, and system adaptation. Jingneng Microelectronics attributes its accumulated capabilities to reliability models, and this positioning is related to its subsequent technology path of extending into power supply chains for AI computing—both scenarios impose similar requirements on device stability under high-temperature, high-power-density, and long-term operating conditions.
AI-grade SST-SiC modules and AIDC power supply chain
Beyond its automotive-grade business, Jingneng Microelectronics recently launched an AI-grade SST-SiC module, mainly used in the power optimization link of AIDC power supply chains. According to the company, the product addresses industry pain points such as high energy efficiency losses and difficulty adapting to dynamic computing loads in ultra-high-power intelligent computing scenarios.
As the power density per cabinet in intelligent computing centers increases, conversion efficiency and dynamic response capability in the power supply chain have become a focus of attention. Due to their material properties, SiC devices are increasingly adopted in related solutions for their performance under high-frequency, high-voltage, and high-temperature conditions; SST (solid-state transformer) is one of the key forms in the power supply chain. Jingneng Microelectronics defines the product as "AI-grade," pointing to its positioning for adaptation in AIDC scenarios.
Next-generation high-voltage conversion technology: joint R&D with customers
Beyond module products, Jingneng Microelectronics is currently collaborating with customers in the SST field on R&D for next-generation high-voltage conversion technology. The two sides have set ultra-high reliability and ultimate power conversion efficiency as core goals, and the R&D results will be delivered for multiple application scenarios, including AI computing infrastructure, new energy, and high-end equipment.
Joint R&D with customers is a common path in the power device industry: device parameters need to match the system topology and control strategy, and early involvement helps shorten the validation cycle. For 晶能微电子, this cooperation also extends the company's technology output scope from automotive-grade and AI computing to scenarios such as new energy and high-end equipment.
Observations from a Going-Global Perspective
The company stated that in the future it will be committed to promoting the innovative development of computing facilities and Physical AI power systems, and steadily advancing toward the goal of becoming a world-leading AI power electronics company. This statement places its market positioning within a global scope.
From a business structure perspective, the application scenarios it disclosed—automotive-grade electrification, AI computing infrastructure, new energy, and high-end equipment—all inherently have cross-regional demand characteristics. Based on currently public information, the company's revenue structure, customer distribution, and localization layout in overseas markets have not yet been disclosed, and its overseas expansion progress still awaits verification by subsequent information. Points to watch include: the pace of implementation of AI-grade SST-SiC modules in intelligent computing projects, the form of output from joint R&D of next-generation high-voltage conversion technology, and the actual implementation of R&D investment and industry chain collaboration after the completion of the shareholding reform.
