Black Sesame C1296 Enters Mass Production: One Chip Converges 10-20 Volume-Model Configurations
On September 16, Black Sesame Technologies said at the 6th Intelligent Vehicle Chip Ecosystem Conference 2026 (Shanghai) that for high-volume models, cockpit and intelligent driving chips are paired in a fragmented way, with a single vehicle model corresponding to dozens of configurations and prominent duplicate development issues. The company launched the Wudang series cross-domain fusion chip C1296, converging more than ten combinations into a single platform, and it has already been mass-produced and deployed on Dongfeng Tianyuan's intelligent driving platform. Its dual-track layout of Huashan and Wudang supports inter-chip P2P compatibility and interoperable toolchains. Against the backdrop of automotive going global, platform-based solutions help automakers cope with tariffs and logistics costs and improve hardware and software reuse and cost amortization at scale.
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