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Global Automotive Chip Market to Reach $96.9B by 2029; Cockpit-Driving Integration Enters Mass Production Validation

Global Automotive Chip Market to Reach $96.9B by 2029; Cockpit-Driving Integration Enters Mass Production Validation

On September 16, the 2026 Sixth Intelligent Vehicle Chip Industry Ecosystem Conference was held in Shanghai. Gu Xiaoying of Gasgoo predicted that the global automotive chip market will grow from USD 67.7 billion in 2024 to USD 96.9 billion in 2029, a compound annual growth rate of 7.4%. E'erte of Black Sesame Technologies introduced the Wudang C1296 cross-domain fusion chip, which has been mass-produced on the Dongfeng Tianyuan intelligent driving platform, focusing on cost reduction through cockpit-driving integration for volume models. The conference showed that cockpit-driving integration has entered a mass-production validation phase, chip growth is shifting from unit count to value per chip, and overseas supply chains need to balance cost and ecosystem collaboration.

30444 days ago
Total Investment Exceeds 7.5 Billion Yuan! USC HITS Advanced Packaging Project Lands in Shanghai Jiading

Total Investment Exceeds 7.5 Billion Yuan! USC HITS Advanced Packaging Project Lands in Shanghai Jiading

On July 30, 2026, Union Semiconductor (USC) held a signing ceremony for its HITS advanced packaging R&D and industrialization project in Shanghai's Jiading District. With total investment expected to reach at least 7.5 billion yuan, the project targets five core technical bottlenecks including ultra-narrow pitch bump bonding and high-density interposer integration, aiming to build the packaging and interconnect foundation for AI servers and high-performance computing chips.

57691 days ago